View UPC8172TB_4608.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

PRELIMINARY DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC8172TB
SILICON MMIC 2.5 GHz FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER
DESCRIPTION
The PC8172TB is a silicon monolithic integrated circuit designed as frequency up-converter for wireless transceiver transmitter stage. This IC is manufactured using NEC's 30 GHz fmax. UHS0 (Ultra High Speed Process) silicon bipolar process. This IC is as same circuit current as conventional PC8106TB, but operates at higher frequency, higher gain and lower distortion. Consequently this IC is suitable for mobile communications.
FEATURES
* Recommended operating frequency : fRFout = 0.8 to 2.5 GHz * Higher IP3 * High-density surface mounting * Supply voltage : CG = 9.5 dB TYP., OIP3 = +7.5 dBm TYP. @ fRFout = 0.9 GHz : 6-pin super minimold package : VCC = 2.7 to 3.3 V
APPLICATIONS
* PCS1900M * 2.4 GHz band transmitter/receiver system (wireless LAN etc.)
ORDERING INFORMATION
Part Number Package 6-pin super minimold Marking C3A Supplying Form * Embossed tape 8 mm wide. * Pin 1, 2, 3 face the tape perforation side. * Qty 3 kpcs/reel.
PC8172TB-E3
Remark
To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: PC8172TB)
Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P14729EJ1V0DS00 (1st edition) Date Published June 2000 N CP(K) Printed in Japan
(c)
2000
PC8172TB
PIN CONNECTIONS
Pin No.
(Top View) (Bottom View)
Pin Name IFinput GND LOinput PS VCC RFoutput
1
C3A
3
4
4
3
2 3
2
5
5
2
4
6 6 1
1
5 6
SERIES PRODUCTS (TA = +25C, VCC = VPS = VRFout = 3.0 V, ZS = ZL = 50 )
Part Number ICC (mA) 9 9 5 16.5 fRFout (GHz) 0.8 to 2.5 0.4 to 2.0 0.4 to.2.0 0.8 to 2.0 CG (dB) @RF 0.9 GHz 9.5 9 6 9
Note
@RF 1.9 GHz 8.5 7 4 5.5
@RF 2.4 GHz 8.0 - - -
PC8172TB PC8106TB PC8109TB PC8163TB
PO(sat) (dBm) Part Number @RF 0.9 GHz
Note
OIP3 (dBm) @RF 2.4 GHz -0.5 - - - @RF 0.9 GHz +7.5 +5.5 +1.5 +9.5
Note
@RF 1.9 GHz 0 -4 -7.5 -2
@RF 1.9 GHz +6.0 +2.0 -1.0 +6.0
@RF 2.4 GHz +4.0 - - -
PC8172TB PC8106TB PC8109TB PC8163TB
+0.5 -2 -5.5 +0.5
Note fRFout = 0.83 GHz @ PC8163TB Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. To know the associated product, please refer to each latest data sheet.
BLOCK DIAGRAM (FOR THE PC8172TB)
(Top View)
LOinput
PS
GND
VCC
IFinput
RFoutput
2
Preliminary Data Sheet P14729EJ1V0DS00
PC8172TB
SYSTEM APPLICATION EXAMPLES (SCHEMATICS OF IC LOCATION IN THE SYSTEM)
Wireless Transceiver
Low Noise Tr. RX DEMOD. I Q
SW
VCO
/N
PLL PLL
I 0 TX PA Phase shifter
PC8172TB
90 Q
To know the associated products, please refer to each latest data sheet.
Preliminary Data Sheet P14729EJ1V0DS00
3
PC8172TB
PIN EXPLANATION
Applied Voltage (V) - Pin Voltage Note (V) 1.4
Pin No. 1
Pin Name IFinput
Function and Explanation
Equivalent Circuit
This pin is IF input to double balanced mixer (DBM). The input is designed as high impedance. The circuit contributes to suppress spurious signal. Also this symmetrical circuit can keep specified performance insensitive to process-condition distribution. For above reason, double balanced mixer is adopted. GND pin. Ground pattern on the board should be formed as wide as possible. Track Length should be kept as short as possible to minimize ground impedance. Local input pin. Recommendable input level is -10 to 0 dBm. Supply voltage pin. This pin is RF output from DBM. This pin is designed as open collector. Due to the high impedance output, this pin should be externally equipped with LC matching circuit to next stage. Power save control pin. Bias controls operation as follows. Pin bias VCC GND Control
4 VCC 5
5 6 3
2
GND
GND
-
1
3
LOinput
-
2.3 - -
5 6
VCC RFoutput
2.7 to 3.3 Same bias as VCC through external inductor VCC/GND
2
4
PS
-
Operation Power Save
GND 2
Note Each pin voltage is measured with VCC = VPS = VRFout = 3.0 V.
4
Preliminary Data Sheet P14729EJ1V0DS00
PC8172TB
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage PS pin Input Voltage Power Dissipation of Package Symbol VCC VPS PD TA = +25C TA = +25C Mounted on double-side copperclad 50 x 50 x 1.6 mm epoxy glass PWB (TA = +85C) Test Conditions Rating 3.6 3.6 200 Unit V V mW
Operating Ambient Temperature Storage Temperature Maximum Input Power
TA Tstg Pin
-40 to +85 -55 to +150 +10
C C dBm
RECOMMENDED OPERATING CONDITIONS
Parameter Supply Voltage Symbol VCC Test Conditions The same voltage should be applied to pin 5 and 6 MIN. 2.7 -40 ZS = 50 (without matching) With external matching circuit -10 0.8 50 TYP. 3.0 MAX. 3.3 Unit V
Operating Ambient Temperature Local Input Level RF Output Frequency IF Input Frequency
TA PLOin fRFout fIFin
+25 -5 - -
+85 0 2.5 400
C dBm GHz MHz
ELECTRICAL CHARACTERISTICS
(TA = +25C, VCC = VRFout = 3.0 V, fIFin = 240 MHz, PLOin = -5 dBm, and VPS 2.7 V unless otherwise specified)
Parameter Circuit Current Circuit Current In Power Save Mode Conversion Gain Symbol ICC ICC(PS) Test Conditions No Signal VPS = 0 V fRFout = 0.9 GHz, PIFin = -30 dBm fRFout = 1.9 GHz, PIFin = -30 dBm fRFout = 2.4 GHz, PIFin = -30 dBm fRFout = 0.9 GHz, PIFin = 0 dBm fRFout = 1.9 GHz, PIFin = 0 dBm fRFout = 2.4 GHz, PIFin = 0 dBm
Note
MIN. 5.5 -
TYP. 9.0 -
MAX. 13 2
Unit mA
A
dB dB dB dBm dBm dBm
CG1 CG2 CG3
6.5 5.5 5 -2.5 -3.5 -4
9.5 8.5 8.0 +0.5 0 -0.5
12.5 11.5 11.0 - - -
Saturated RF Output Power
PO(sat)1 PO(sat)2 PO(sat)3
Note fRFout < fLoin @ fRFout = 0.9 GHz fLoin < fRFout @ fRFout = 1.9 GHz/2.4 GHz
Preliminary Data Sheet P14729EJ1V0DS00
5
PC8172TB
OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY
(TA = +25C, VCC = VRFout = 3.0 V, PLOin = -5 dBm, and VPS 2.7 V unless otherwise specified)
Parameter Output Third-Order Distortion Intercept Point Symbol OIP31 OIP32 OIP33 Input Third-Order Distortion Intercept Point IIP31 IIP32 IIP33 SSB Noise Figure SSB*NF1 SSB*NF2 SSB*NF3 Power Save Response Time Rise time Fall time TPS(rise) TPS(fall) fRFout = 0.9 GHz fRFout = 1.9 GHz fRFout = 2.4 GHz fRFout = 0.9 GHz fRFout = 1.9 GHz fRFout = 2.4 GHz fRFout = 0.9 GHz, fIFin = 240 MHz fRFout = 1.9 GHz, fIFin = 240 MHz fRFout = 2.4 GHz, fIFin = 240 MHz VPS: GND VCC VPS: VCC GND fIFin1 = 240 MHz fIFin2 = 241 MHz fIFin1 = 240 MHz fIFin2 = 241 MHz Test Conditions
Note
Data +7.5 +6.0 +4.0 -2.0 -2.5 -4.0 9.5 10.4 10.6 1 1.5
Unit dBm dBm dBm dBm dBm dBm dB dB dB
s s
Note fRFout < fLoin @ fRFout = 0.9 GHz fLoin < fRFout @ fRFout = 1.9 GHz/2.4 GHz
6
Preliminary Data Sheet P14729EJ1V0DS00
PC8172TB
TEST CIRCUIT 1 (fRFout = 900 MHz)
Strip Line Spectrum Analyzer 100 pF 6 50 10 nH 5 1 000 pF VCC 1 F 68 pF 1 F 1 000 pF VCC GND 2 100 pF 4 PS LOinput 3 50 Signal Generator RFoutput IFinput 1 50 Signal Generator
100 pF 1 pF
TEST CIRCUIT 2 (fRFout = 1.9 GHz)
Strip Line Spectrum Analyzer 50 100 pF 6 2.75 pF 470 nH 5 1 000 pF VCC 1 F 30 pF 1 F 1 000 pF VCC GND 2 100 pF 4 PS LOinput 3 50 Signal Generator RFoutput IFinput 1 50 100 pF Signal Generator
TEST CIRCUIT 3 (fRFout = 2.4 GHz)
Strip Line Spectrum Analyzer 50 100 pF 6 1.75 pF 470 nH 5 1 000 pF VCC 1 F 10 pF 1 F 1 000 pF VCC GND 2 100 pF 4 PS LOinput 3 50 Signal Generator RFoutput IFinput 1 50 Signal Generator
100 pF
Preliminary Data Sheet P14729EJ1V0DS00
7
PC8172TB
PACKAGE DIMENSIONS
6-pin super minimold (Unit: mm)
2.10.1 1.250.1
2.00.2
1.3
0.65
0.65
0.1 MIN.
0.90.1
0.7
8
Preliminary Data Sheet P14729EJ1V0DS00
0 to 0.1
0.15+0.1 -0
0.2+0.1 -0.05
PC8172TB
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electrostatic sensitive devices. (2) Form a ground pattern as wide as possible to keep the minimum ground impedance (to prevent undesired oscillation). (3) Connect a bypass capacitor (example: 1 000 pF) to the VCC pin. (4) Connect a matching circuit to the RF output pin. (5) The DC cut capacitor must be each attached to the input and output pins.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative.
Soldering Method Infrared Reflow Soldering Conditions Package peak temperature: 235C or below Time: 30 seconds or less (at 210C) Note Count: 3, Exposure limit: None Package peak temperature: 215C or below Time: 40 seconds or less (at 200C) Note Count: 3, Exposure limit: None Soldering bath temperature: 260C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None Pin temperature: 300C Time: 3 seconds or less (per side of device) Note Exposure limit: None Recommended Condition Symbol IR35-00-3
VPS
VP15-00-3
Wave Soldering
WS60-00-1
Partial Heating
-
Note After opening the dry pack, keep it in a place below 25C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Preliminary Data Sheet P14729EJ1V0DS00
9
PC8172TB
[MEMO]
10
Preliminary Data Sheet P14729EJ1V0DS00
PC8172TB
[MEMO]
Preliminary Data Sheet P14729EJ1V0DS00
11
PC8172TB
ATTENTION
OBSERVE PRECAUTIONS FOR HANDLING
ELECTROSTATIC SENSITIVE DEVICES
* The information in this document is current as of June, 2000. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
M8E 00. 4

▲Up To Search▲

Price & Availability of UPC8172TB

	To Download UPC8172TB Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .